Thermal Interface Material (TIM)
We have processing experience with boards for earth and sensors! The "softness" makes processing and handling difficult.
To soften TIM materials (thermal interface materials), it is necessary to reduce the resistance between different materials, while maintaining electrical insulation (with some components requiring conductivity) and achieving low thermal resistance. For example, there is a concept of directly bonding metal materials using silver or copper paste without TIM materials in between. However, when dealing with dissimilar materials, the surface roughness of each material creates gaps that can trap air, resulting in increased thermal resistance. To expel this air, TIM is inserted, and softness is required to easily fill these gaps, but this "softness" complicates processing and handling. [Main Processing Achievements] ■ Information Communication: Antennas, grounding, LCD conduction, noise countermeasures ■ Automotive: Sensor substrates *For more details, please refer to the PDF document or feel free to contact us.
- 企業：オーティス
- 価格：Other
